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 (R)
P01 Series
0.8A SCRs
SENSITIVE
MAIN FEATURES:
Symbol IT(RMS) VDRM/VRRM IGT Value 0.8 400 and 600 5 to 200 Unit A V A
G
A
K
DESCRIPTION Thanks to highly sensitive triggering levels, the P01 SCR series is suitable for all applications where available gate current is limited, such as ground fault circuit interruptors, pilot circuits in solid state relays, stand-by mode power supplies, smoke and alarm detectors. Available in through-hole or surface mount packages, the voltage capability of this series has been upgrated since its introduction, to reach 600 V.
TO-92 (P01xxA)
SOT-223 (P01xxN)
ABSOLUTE RATINGS (limiting values)
Symbol IT(RMS) RMS on-state current (180 conduction angle) Average on-state current (180 conduction angle) Non repetitive surge peak on-state current It Value for fusing Critical rate of rise of on-state current IG = 2 x IGT , tr 100 ns Peak gate current Average gate power dissipation Storage junction temperature range Operating junction temperature range Parameter TO-92 SOT-223 TO-92 SOT-223 tp = 8.3 ms tp = 10 ms tp = 10ms F = 60 Hz tp = 20 s Tj = 25C Tj = 25C Tj = 125C Tj = 125C Tj = 125C Tl = 55C 0.8 Tamb = 70C Tl = 55C 0.5 Tamb = 70C 8 7 0.24 50 1 0.1 - 40 to + 150 - 40 to + 125 A A2S A/s A W C A A Value Unit
IT(AV)
ITSM
I t dI/dt IGM PG(AV) Tstg Tj
September 2000 - Ed: 3
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P01 Series
ELECTRICAL CHARACTERISTICS (Tj = 25C, unless otherwise specified)
Symbol IGT VD = 12 V VGT VGD VRG IH IL dV/dt VTM Vt0 Rd IDRM IRRM VD = VDRM RL = 3.3 k RGK = 1 k IRG = 10 A IT = 50 mA IG = 1 mA ITM = 1.6 A RGK = 1 k RGK = 1 k RGK = 1 k Tj = 125C Tj = 25C Tj = 125C Tj = 125C RGK = 1 k RGK = 1 k RGK = 1 k Tj = 25C Tj = 125C MAX. tp = 380 s Tj = 125C RL = 140 Test Conditions 02 MIN. MAX. MAX. MIN. MIN. MAX. MAX. MIN. MAX. MAX. MAX. MAX. 75 200 P01xx Unit 11 4 25 0.8 0.1 8 5 6 80 1.95 0.95 600 1 10 100 75 18 0.5 5 A V V V mA mA V/s V V m A A A
VD = 67 % VDRM
Threshold voltage Dynamic resistance VDRM = VRRM = 400 V VDRM = VRRM = 600 V VDRM = VRRM
THERMAL RESISTANCES
Symbol Rth(j-i) Rth(j-t) Rth(j-a) Junction to case (DC) Junction to tab (DC) Junction to ambient S=5
S = Copper surface under tab
Parameter TO-92 SOT-223 TO-92 cm SOT-223
Value 80 30 150 60
Unit C/W
C/W
PRODUCT SELECTOR
Part Number 400 V P0102DA P0102DN P0102MA P0102MN P0111DA P0111DN P0111MA P0111MN P0118DA P0118DN P0118MA P0118MN X X X X X X X X X X X X Voltage 600 V 200 A 200 A 200 A 200 A 25 A 25 A 25 A 25 A 5 A 5 A 5 A 5 A TO-92 SOT-223 TO-92 SOT-223 TO-92 SOT-223 TO-92 SOT-223 TO-92 SOT-223 TO-92 SOT-223 Sensitivity Package
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P01 Series
ORDERING INFORMATION
P 01 02
SENSITIVE SCR SERIES CURRENT: 0.8A
DN
VOLTAGE: D: 400V M: 600V
Blank
1AA3
PACKING MODE: 1AA3: TO-92 bulk (preferred) 2AL3: TO-92 ammopack 5AA4: SOT-223 Tape & Reel
PACKAGE: A: TO-92 N: SOT-223
SENSITIVITY: 02: 200A 11: 25A 18: 5A
OTHER INFORMATION
Part Number P01xxyA 1AA3 P01xxyA 2AL3 P0102yN 5AA4 P0111yN 5AA4 P0118yN 5AA4 Marking P01xxyA P01xxyA P2y P1y P8y Weight 0.2 g 0.2 g 0.12 g 0.12 g 0.12 g Base Quantity 2500 2000 1000 1000 1000 Packing mode Bulk Ammopack Tape & reel Tape & reel Tape & reel
Note: xx = sensitivity, y = voltage
Fig. 1: Maximum average power dissipation versus average on-state current.
P(W) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 0.0
Fig. 2-1: Average and D.C. on-state current versus lead temperature.
IT(av)(A)
1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0
Tlead or Ttab (C)
0 25 50 75 100 125
0.1
0.2
0.3
0.4
0.5
0.6
Fig. 2-2: Average and D.C. on-state current versus ambient temperature (device mounted on FR4 with recommended pad layout for SOT-223).
IT(av)(A)
Fig. 3: Relative variation of thermal impedance junction to ambient versus pulse duration.
K = [Zth(j-a)/Rth(j-a)]
1.00
1.2 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0
0.10
Tamb(C)
0 25 50 75 100 125 0.01 1E-2 1E-1
tp(s)
1E+0 1E+1 1E+2 5E+2
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P01 Series
Fig. 4: Relative variation of gate trigger current, holding current and latching current versus junction temperature (typical values).
IGT, IH, IL[Tj] / IGT, IH, IL[T] = 25C
Fig. 5:Relative variation of holding current versus gate-cathode resistance (typical values).
IH[Rgk]/IH[Rgk=1k]
6 5 4 3 2 1
Tj(C)
0 -40
Rgk(k)
-20
0
20
40
60
80
100
120
140
Fig. 6: Relative variation of dV/dt immunity versus gate-cathode resistance (typical values).
dV/dt[Rgk] / dV/dt[Rgk=1k]
Fig. 7: Relative variation of dV/dt immunity versus gate-cathode capacitance (typical values).
dV/dt[Cgk] / dV/dt[Rgk=1k]
10.0
10 8 6
1.0 4 2
Rgk(k) Cgk(nF)
0.1 0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
0
0
1
2
3
4
5
6
7
Fig. 8: Surge peak on-state current versus number of cycles.
Fig. 9: Non-repetitive surge peak on-state current for a sinusoidal pulse with width tp < 10 ms, and corresponding value of It.
ITSM(A), I2t(A2s)
ITSM(A) 8 7
tp=10ms
100.0
6 5 4 3 2 1 0 1 10
Repetitive Tamb=25C Non repetitive Tj initial=25C
Onecycle
10.0
1.0 Numberofcycles 100 1000 0.1 0.01 0.10
tp(ms)
1.00
10.00
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P01 Series
Fig. 10: On-state characteristics (maximum values).
Fig. 11: SOT-223 Thermal resistance junction to ambient versus copper surface under tab (Epoxy printed circuit board FR4, copper thickness: 35 m).
Rth(j-a) (C/W) 130 120 110 100 90 80 70 60 50 40 30 20 10 0 0.0 0.5 1.0 1.5
ITM(A)
1E+1
1E+0
1E-1
VTM(V)
S (cm2)
1E-2 0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
2.0
2.5
3.0
3.5
4.0
4.5 5.0
PACKAGE MECHANICAL DATA TO-92 (Plastic)
DIMENSIONS REF.
A a B C
Millimeters Min. Typ. 1.35 4.70 2.54 4.40 12.70 3.70 0.50 0.173 0.500 Max. Min.
Inches Typ. 0.053 0.185 0.100 Max.
F
D
E
A B C D E F a
0.146 0.019
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P01 Series
PACKAGE MECHANICAL DATA SOT-223 (Plastic)
DIMENSIONS
A A1 B e1 D B1 V c
REF.
Millimeters Min. Typ. Max. Min.
Inches Typ. Max.
HE
e
A A1 B B1 c D e e1 E H V
0.02 0.60 2.90 0.24 6.30
3.30 6.70
0.70 3.00 0.26 6.50 2.3 4.6 3.50 7.00
1.80 0.071 0.1 0.0008 0.004 0.85 0.024 0.027 0.034 3.15 0.114 0.118 0.124 0.35 0.009 0.010 0.014 6.70 0.248 0.256 0.264 0.090 0.181 3.70 0.130 0.138 0.146 7.30 0.264 0.276 0.287 10 max
FOOTPRINT DIMENSIONS (in millimeters) SOT-223 (Plastic)
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. (c) The ST logo is a registered trademark of STMicroelectronics (c) 2000 STMicroelectronics - Printed in Italy - All Rights Reserved STMicroelectronics GROUP OF COMPANIES Australia - Brazil - China - Finland - France - Germany - Hong Kong - India - Italy - Japan - Malaysia - Malta - Morocco Singapore - Spain - Sweden - Switzerland - United Kingdom http://www.st.com
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